Thin metallization film area
- Introduction
Equipment including two E-beam evaporators for contact metallization and a rapid thermal anneal (RTA) set-up for contact annealing.
Thickness uniformity is well controlled.
Evaporation angle is also well controlled. Front metal gridline profile is >80 degrees.
Thickness uniformity is well controlled.
Evaporation angle is also well controlled. Front metal gridline profile is >80 degrees.
